Semiconductor Equipment Parts We Machine
Representative semiconductor part families, including the thin-wall program for the world's leading semiconductor lithography equipment maker.
Part Families, Tolerances, Order Patterns
| Part family | Common materials | Key tolerances | Typical finish | Typical order |
|---|---|---|---|---|
| Thin-wall chamber core parts | SUS304 | 0.3 mm wall, GD&T within 0.01 mm | Ra 0.4, cleaned and packed | repeat batches |
| Precision lens barrels | SUS304, 6061-T6 | Concentricity 0.005 mm, Ra 0.4 bores | Bare or black anodized | 50 to 500 pcs |
| Alignment stage components | 7075-T6 | +/-0.002 mm datum features | Stress relieved, bare | 20 to 200 pcs |
| Gas and fluid manifold bodies | 316L | +/-0.01 mm ports, leak-tested | Passivated | 100 to 1,000 pcs |
| Wafer-handling test tooling | 6061-T6, PEEK pads | +/-0.02 mm repeatability | Clear anodize | 10 to 100 pcs |
| ESD handling components | ESD225, ESD420 PEEK | ESD resistivity certified, +/-0.02 mm | Double bagged | 50 to 500 pcs |
| Vacuum chamber fixtures | 6061-T6, 316L | Outgassing safe finish, +/-0.02 mm | Cleaned, vacuum packed | 20 to 200 pcs |
| Gas panel fittings | 316L | Orifice +/-0.01 mm, leak tested | Passivated | 100 to 1,000 pcs |
| Robot arm parts for wafer handlers | 7075-T6 | Datum features +/-0.005 mm | Bare, stress relieved | 20 to 200 pcs |
| Calibration and test artifacts | MIC-6, Invar on request | Flat 0.005 mm | Bare | 5 to 50 pcs |
How to use this page: these are families we run repeatedly, so process risk is low and lead times are predictable. If your part is not listed, it is likely still in scope: send the drawing and we answer within 24 hours.
Thin-wall detail: turning and live tooling.
Semiconductor Parts FAQ
Which program is your semiconductor benchmark?
Thin-wall SUS304 core parts for the world's leading semiconductor lithography equipment maker: 0.3 mm walls, Ra 0.4, GD&T within 0.01 mm, in repeat batches.
How are ESD parts certified?
Surface resistivity certificates accompany ESD225/ESD420 shipments, and parts are double bagged per semiconductor packing practice.
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