CNC Machining for Semiconductor Equipment

Semiconductor Equipment Parts

KGL machines ultra-precision components for semiconductor equipment manufacturers. Our 5-axis Mazak centers and Hexagon CMM (0.0015 mm accuracy) deliver the geometric precision and surface finish that semiconductor applications require.

Typical Parts

• Chamber components and shielding
• Electrode and focus ring components
• Precision mounting plates
• ESD-sensitive components in conductive plastics

Materials

Aluminum (6061-T6, 7075), stainless steel (316L, 17-4PH), PEEK, PEEK1000, PEI, ESD225, ESD420, and conductive nylon.

Cleanliness and Packing

Chamber components, fixtures and vacuum-adjacent parts are deburred, ultrasonically cleaned, dried and sealed in PE bags; nitrile-glove handling and cleaning records ship with the inspection report. Thin-wall geometries are CMM-verified on Hexagon and Zeiss machines before release, so flatness and coaxiality arrive as documented values, not promises.

Typical parts: 10 part families with tolerances and typical order sizes.

Process Coverage for Semiconductor Programs

Semiconductor equipment parts combine tight geometry with cleanliness requirements. We machine them on 11 five-axis Mazak centers for optical and vacuum geometries, with turning cells for lens barrels and sealing joints, and a dedicated support cell for wire EDM features. Chamber-adjacent parts are deburred, ultrasonically cleaned, dried, and sealed in PE bags, with nitrile-glove handling and cleaning records shipped alongside the inspection report.

Tolerances, Materials and Documents

Feature class	Standard capability	Verified by
Alignment and mounting interfaces	±0.005 mm	CMM report per lot
Thin-wall flatness and coaxiality	within 0.01 mm	Hexagon / Zeiss CMM
Optical seating faces	Ra 0.4 or better	Surface roughness records
ESD-grade plastics machining	ESD225 / ESD420, conductive nylon	Material certificates

Materials in regular production include 6061-T6 and 7075 aluminum, 316L and 17-4PH stainless steel, titanium, PEEK, PEI, and ESD-grade plastics. Documentation packages cover material certificates, FAI, and batch dimensional reports for your equipment qualification files.